DocumentCode
3556860
Title
Application of rapid thermal oxidation to the development of high dielectric strength polyoxides
Author
Maury, A. ; Kim, S.C. ; Manocha, A. ; Oh, K.H. ; Kostelnick, D. ; Shive, S.
Author_Institution
AT&T Bell Laboratories, Allentown, Pennsylvania
Volume
32
fYear
1986
fDate
1986
Firstpage
676
Lastpage
679
Abstract
Electrical and morphological characteristics of thin oxides (∼200Å), grown by either Rapid Thermal Oxidation (RTO) or conventional furnace, on amorphous, in-situ phosphorus doped silicon films, have been studied. The results are compared to those obtained from oxidizing polysilicon films doped with phosphorus at 950°C from a PBr3 source. The polyoxides grown by RTO on amorphous, in-situ doped silicon exhibit high breakdown fields (∼9.0 MV/cm) and low leakage current. Oxidation of the same films in a conventional furnace produces polyoxides with lower (∼6.0 MV/cm) breakdown fields. The breakdown fields of oxides grown on PBr3 doped films are low (less than 5.5 MV/cm and strongly dependent on phosphorus concentration. RTO and conventional furnace polyoxides grown on PBr3 doped polysilicon exhibit similar characteristics.
Keywords
Amorphous materials; Bioreactors; Dielectric breakdown; Dielectric thin films; Electric breakdown; Furnaces; Leakage current; Oxidation; Semiconductor films; Silicon;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1986 International
Type
conf
DOI
10.1109/IEDM.1986.191282
Filename
1486540
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