• DocumentCode
    3556860
  • Title

    Application of rapid thermal oxidation to the development of high dielectric strength polyoxides

  • Author

    Maury, A. ; Kim, S.C. ; Manocha, A. ; Oh, K.H. ; Kostelnick, D. ; Shive, S.

  • Author_Institution
    AT&T Bell Laboratories, Allentown, Pennsylvania
  • Volume
    32
  • fYear
    1986
  • fDate
    1986
  • Firstpage
    676
  • Lastpage
    679
  • Abstract
    Electrical and morphological characteristics of thin oxides (∼200Å), grown by either Rapid Thermal Oxidation (RTO) or conventional furnace, on amorphous, in-situ phosphorus doped silicon films, have been studied. The results are compared to those obtained from oxidizing polysilicon films doped with phosphorus at 950°C from a PBr3source. The polyoxides grown by RTO on amorphous, in-situ doped silicon exhibit high breakdown fields (∼9.0 MV/cm) and low leakage current. Oxidation of the same films in a conventional furnace produces polyoxides with lower (∼6.0 MV/cm) breakdown fields. The breakdown fields of oxides grown on PBr3doped films are low (less than 5.5 MV/cm and strongly dependent on phosphorus concentration. RTO and conventional furnace polyoxides grown on PBr3doped polysilicon exhibit similar characteristics.
  • Keywords
    Amorphous materials; Bioreactors; Dielectric breakdown; Dielectric thin films; Electric breakdown; Furnaces; Leakage current; Oxidation; Semiconductor films; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1986 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1986.191282
  • Filename
    1486540