Title :
A planar multi-level tungsten interconnect technology
Author :
Thomas, D.C. ; Wong, S.S.
Author_Institution :
Cornell University, Ithaca, New York
Keywords :
Adhesives; Atomic layer deposition; Conductivity; Dielectric substrates; Etching; Implants; Metallization; Resists; Tungsten; Very large scale integration;
Conference_Titel :
Electron Devices Meeting, 1986 International
DOI :
10.1109/IEDM.1986.191321
