DocumentCode
3556902
Title
A planar multi-level tungsten interconnect technology
Author
Thomas, D.C. ; Wong, S.S.
Author_Institution
Cornell University, Ithaca, New York
Volume
32
fYear
1986
fDate
1986
Firstpage
811
Lastpage
813
Keywords
Adhesives; Atomic layer deposition; Conductivity; Dielectric substrates; Etching; Implants; Metallization; Resists; Tungsten; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1986 International
Type
conf
DOI
10.1109/IEDM.1986.191321
Filename
1486579
Link To Document