DocumentCode
3557077
Title
BSA Technology for sub-100nm deep base bipolar transistors
Author
Takemura, H. ; Ohi, S. ; Sugiyama, M. ; Tashiro, T. ; Nakamae, M.
Author_Institution
NEC Corporation, Kanagawa, Japan
Volume
33
fYear
1987
fDate
1987
Firstpage
375
Lastpage
378
Abstract
This paper will describe a novel self-aligned technology, BSA (BSG Self-Aligned) technology. The BSA technology makes it possible to realize the self-aligned bipolar transistors having sub- 100nm deep base junction and to solve the problems in lateral and vertical scaling down of self-aligned transistors. The BSA technology is featured by the use of BSG film not only as a sidewall spacer but also as a diffusion source to form both the intrinsic base and p+-link regions by rapid thermal annealing (RTA), simultaneously. The typical BSA transistor having sub-100nm deep base junction showed 70 of hFE , 7V of BVCEO and 3V of BVEBO , respectively.
Keywords
Atomic layer deposition; Bipolar transistors; Boron; Etching; Fabrication; Ion implantation; National electric code; Parasitic capacitance; Rapid thermal annealing; Space technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1987 International
Type
conf
DOI
10.1109/IEDM.1987.191435
Filename
1487393
Link To Document