• DocumentCode
    3557077
  • Title

    BSA Technology for sub-100nm deep base bipolar transistors

  • Author

    Takemura, H. ; Ohi, S. ; Sugiyama, M. ; Tashiro, T. ; Nakamae, M.

  • Author_Institution
    NEC Corporation, Kanagawa, Japan
  • Volume
    33
  • fYear
    1987
  • fDate
    1987
  • Firstpage
    375
  • Lastpage
    378
  • Abstract
    This paper will describe a novel self-aligned technology, BSA (BSG Self-Aligned) technology. The BSA technology makes it possible to realize the self-aligned bipolar transistors having sub- 100nm deep base junction and to solve the problems in lateral and vertical scaling down of self-aligned transistors. The BSA technology is featured by the use of BSG film not only as a sidewall spacer but also as a diffusion source to form both the intrinsic base and p+-link regions by rapid thermal annealing (RTA), simultaneously. The typical BSA transistor having sub-100nm deep base junction showed 70 of hFE, 7V of BVCEOand 3V of BVEBO, respectively.
  • Keywords
    Atomic layer deposition; Bipolar transistors; Boron; Etching; Fabrication; Ion implantation; National electric code; Parasitic capacitance; Rapid thermal annealing; Space technology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting, 1987 International
  • Type

    conf

  • DOI
    10.1109/IEDM.1987.191435
  • Filename
    1487393