DocumentCode
3557126
Title
Scaling studies of CMOS SRAM soft-error tolerances - From 16K to 256K
Author
Fu, J.S. ; Lee, K.H. ; Koga, R. ; Hewlett, F.W. ; Flores, R. ; Anderson, R.E. ; Desko, J.C. ; Nagy, W.J. ; Shimer, J.A. ; Kohler, R.A. ; Steenwyk, S.D.
Author_Institution
Sandia National Laboratories, Albuquerque, NM
fYear
1987
fDate
6-9 Dec. 1987
Firstpage
540
Lastpage
543
Abstract
The processing and design geometric scaling effects on the soft-error tolerance levels of the 16K 2-µm technology and the 256K 1-µm technology CMOS SRAMs are separated by fabricating the 16K 2-µm design with the 1-µm process. Although the 1-µm twin-tub process is inherently more tolerant than the p-well process to soft errors, the densely packed 1-µm memory cells become very soft because of the dominant effect of the channel width reduction. An advanced device-plus-circuit simulator was used to calculate the differential contribution from each of the vertical and lateral dimensional changes involved in the technology transition. Good agreement between the simulations and the experimental data is reached by properly correcting the 2D model to account for the phenomenal saturation effect involving very heavy ions.
Keywords
CMOS process; CMOS technology; Capacitance; Doping; Laboratories; Process design; Random access memory; Resistors; Semiconductor device modeling; Solid modeling;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1987 International
Conference_Location
Washington, DC, USA
Type
conf
DOI
10.1109/IEDM.1987.191482
Filename
1487440
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