DocumentCode
3557149
Title
Design methodology for deep submicron CMOS
Author
Tanaka, Katsuhiko ; Fukuma, Masao
Author_Institution
NEC Corporation, Kawasaki, Japan
Volume
33
fYear
1987
fDate
1987
Firstpage
628
Lastpage
631
Abstract
A design methodology for optimizing deep submicron CMOS devices is proposed, where gate oxide thickness Tox and supply voltage Vdd are the main parameters. An operational region where all the constraints are satisfied, is represented in a simple 2D (Vdd -Tox ) plane. Parameter optimization for realizing high performance of given circuits can be achieved with excellent prospects. This method was utilized for 0.25µm CMOS design to demonstrate its usefulness. Optimum supply voltage and oxide thickness are expected to be 2V and 6nm, respectively. Sensitivity analysis showed that a surface channel is preferable to a buried channel.
Keywords
Circuits; Design methodology; Design optimization; Impurities; MOSFETs; Microelectronics; National electric code; Sensitivity analysis; Threshold voltage; Ultra large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting, 1987 International
Type
conf
DOI
10.1109/IEDM.1987.191506
Filename
1487464
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