Novel dielectrically isolated intelligent power IC technology using vertical lateral composite structure (VLCS)

A new dielectrically isolated IC structure, Vertical Lateral Composite Structure (VLCS), was developed for intelligent power IC´s. The VLCS achieves large current capacity since it can reduce both electrical and thermal resistance of integrated power devices, and it realizes accurate photoetching for high density logics since it can reduce the bowing height of dielectrically isolated wafers. By using the VLCS, an intelligent monolithic power IC technology of 400V, 20A class was achieved. Furthermore, feasibility of the VLCS IC´s with multi vertical output power devices was confirmed.