Title :
All lead free IGBT module with excellent reliability
Author :
Nishimura, Y. ; Oonishi, K. ; Morozumi, A. ; Mochizuki, E. ; Takahashi, Y.
Author_Institution :
Fuji Electr. Device Technol. Co., Ltd., Matsumoto, Japan
Abstract :
The subject of lead free solder application of IGBT module is reliability of solder under the insulated substrate in temperature cycling test. This paper presents all lead free IGBT modules with excellent reliability. This was achieved by optimizing of the thermal expansion coefficient of insulated substrate and using Sn-Ag-In solder.
Keywords :
indium alloys; insulated gate bipolar transistors; reliability; silver alloys; solders; substrates; thermal expansion; tin alloys; IGBT module; SnAgIn; insulated substrate; lead free solder application; solder reliability; temperature cycling test; thermal expansion coefficient; Ceramics; Copper; Environmentally friendly manufacturing techniques; Insulated gate bipolar transistors; Insulation; Lead; Soldering; Temperature; Thermal conductivity; Thermal expansion;
Conference_Titel :
Power Semiconductor Devices and ICs, 2005. Proceedings. ISPSD '05. The 17th International Symposium on
Print_ISBN :
0-7803-8890-9
DOI :
10.1109/ISPSD.2005.1487955
