DocumentCode :
3557479
Title :
20V Asymmetric Complementary Power Device Implementation within a 0.25um CMOS Technology for Power Management
Author :
Letavic, T. ; Cook, R. ; Brock, R. ; Effing, H. ; Einerhand, R.
Author_Institution :
Philips Semicond., Hopewell Junction, NY
fYear :
2005
fDate :
23-26 May 2005
Firstpage :
367
Lastpage :
370
Abstract :
This paper presents a process flow in which a 20V-class of power devices is added to baseline 0.25mum CMOS technology by forming asymmetric extended-drain device structures in which shallow-trench-isolation (STI) is incorporated within the device unit cell, forming a gate extended-drain dielectric region. The Rsp-BVds figure-of-merit is consistent with best-in-class for this device construction (0.16 mOhm cm2/24V), and the isolated high-voltage diode capability make this process cost-effective for implementation of mobile power management circuit topologies, including multiple-output DC-DC converters, battery chargers, linear regulators, audio power amplifiers, and white-light backlighting systems
Keywords :
CMOS integrated circuits; isolation technology; power integrated circuits; semiconductor technology; 0.25 micron; CMOS integrated circuits; asymmetric complementary power device; asymmetric extended-drain device structures; gate extended-drain dielectric region; isolated high-voltage diode capability; isolation technology; mobile power management circuit topologies; power integrated circuits; power management application; shallow-trench-isolation; Battery management systems; CMOS process; CMOS technology; Circuit topology; DC-DC power converters; Dielectric devices; Diodes; Energy management; Power system management; Technology management;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Power Semiconductor Devices and ICs, 2005. Proceedings. ISPSD '05. The 17th International Symposium on
Conference_Location :
Santa Barbara, CA
Print_ISBN :
0-7803-8890-9
Type :
conf
DOI :
10.1109/ISPSD.2005.1488027
Filename :
1488027
Link To Document :
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