Title :
Cu(InGa)Se2 thin films by elemental co-evaporation/sputtering and large area module results
Author :
Sang, B. ; Chen, T. ; Akhtar, M. ; Govindarajan, R. ; Delahoy, A.E. ; Pankow, J.
Author_Institution :
Energy Photovoltaics, Inc., USA
Abstract :
We report process optimization and understanding resulting in high quality Cu(In,Ga)Se2 (CIGS) films and high efficiency devices/modules using a hybrid process for CIGS formation. In the hybrid process, the Cu is supplied by magnetron sputtering, and the In, Ga, and Se are supplied by linear thermal sources. The advantages of the hybrid process include: i) the ease and precision of Cu thickness control; and ii) flexibility to adjust the Ga depth profile. The investigation was conducted in a large-area, pilot-line system. Among others, important parameters were found to be the Cu/(In+Ga) ratio of the Cu/(InGa)2Se3 precursor, selenization temperature, and timing of the Ga and In fluxes. Cell efficiencies of over 13.0% and module efficiencies of 7.5% (26 W, 0.35 m2) were achieved. The film properties were investigated by XRD, SEM, and AES.
Keywords :
Auger electron spectra; X-ray diffraction; copper compounds; gallium compounds; indium compounds; photovoltaic cells; scanning electron microscopy; semiconductor growth; semiconductor thin films; sputter deposition; ternary semiconductors; vacuum deposition; 13 percent; 26 W; 7.5 percent; AES; CIGS formation; Cu(InGa)Se2; Cu(InGa)Se2 thin films; Cu/(In+Ga) ratio; SEM; XRD; cell efficiency; depth profile; elemental co-evaporation/sputtering; film properties; hybrid process; large area module results; linear thermal sources; magnetron sputtering; module efficiency; pilot-line system; process optimization; selenization temperature; thickness control; Glass; Optical device fabrication; Photovoltaic cells; Plasma temperature; Spectroscopy; Sputtering; Substrates; Thickness control; Transistors; X-ray scattering;
Conference_Titel :
Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
Print_ISBN :
0-7803-8707-4
DOI :
10.1109/PVSC.2005.1488107