Title :
Regeneration microelectrode arrays for direct interface to nerves
Author_Institution :
Dept. of Electr. Eng., Stanford Univ., CA, USA
Abstract :
The development and testing of a microelectrode array for implantation in the path of a regenerating nerve are underway. A silicon substrate perforated by an array of holes (via holes) is implanted between the deliberately severed ends of a nerve. Axons regenerate through the via holes and thus become spatially fixed with respect to microelectrodes located on the surface of the silicon. Processes were developed for the fabrication of thin-film iridium microelectrodes, micromachined via holes, and silicon nitride passivation layers. All fabrication methods were designed to be compatible with standard CMOS/BiCMOS processes to allow for on-chip signal processing circuits in future designs. The author provides an overview of these fabrication methods, the in vivo testing of passive neural interfaces, and a prototype active circuit version.<>
Keywords :
BIMOS integrated circuits; CMOS integrated circuits; biological techniques and instruments; biomedical electronics; electrodes; electronic equipment testing; integrated circuit technology; neurophysiology; BiCMOS; CMOS; Ir; Si; Si-SiO/sub 2/-Si/sub 3/N/sub 4/; Si/sub 3/N/sub 4/; axions; direct interface; fabrication; implantation; in vivo testing; microelectrode array; on-chip signal processing circuits; passivation layers; passive neural interfaces; prototype active circuit; regenerating nerve; thin-film iridium microelectrodes; via holes; Circuit testing; Fabrication; Microelectrodes; Nerve fibers; Passivation; Semiconductor thin films; Signal design; Silicon; Substrates; Thin film circuits;
Conference_Titel :
Solid-State Sensors and Actuators, 1991. Digest of Technical Papers, TRANSDUCERS '91., 1991 International Conference on
Conference_Location :
San Francisco, CA, USA
Print_ISBN :
0-87942-585-7
DOI :
10.1109/SENSOR.1991.148814