• DocumentCode
    3557609
  • Title

    Enhanced adhesion of EVA laminates to primed glass substrates subjected to damp heat exposure

  • Author

    Pern, F.J. ; Jorgensen, G.J.

  • Author_Institution
    Nat. Center for Photovoltaics, Nat. Renewable Energy Lab., Golden, CO, USA
  • fYear
    2005
  • fDate
    3-7 Jan. 2005
  • Firstpage
    495
  • Lastpage
    498
  • Abstract
    We investigated the effectiveness of glass-surface priming to promote enhanced adhesion of EVA laminates during damp-heat exposure at 85°C and 85% relative humidity. The primary objective was to develop advanced encapsulant formulations by incorporation of various primer formulations that exhibit improved adhesion during damp-heat exposure. Several primer formulations were identified that greatly enhanced the EVA adhesion strength, including to the extent that peeling could not be initiated, even for the laminates of the glass substrate/fast-cure EVA15295P/TPE backsheet (a Tedlar/polyester/EVA tri-laminate) that were exposed in a damp-heat test chamber for more than 750 h. The results show that a synergistic increase in the interfacial hydrophobicity, siloxane density, and cross-linking density are the key attributes to the improvement in the EVA adhesion strength.
  • Keywords
    adhesion; composite material interfaces; encapsulation; glass; heat treatment; laminates; polymers; substrates; 750 h; 85 degC; EVA laminates; SiO2; TPE backsheet; Tedlar/polyester/EVA tri-laminate; adhesion strength; advanced encapsulant formulations; cross-linking density; damp heat exposure; enhanced adhesion; fast-cure EVA15295P; glass-surface priming; interfacial hydrophobicity; peeling; primed glass substrates; primer formulations; siloxane density; Adhesives; Glass; Humidity; Laboratories; Laminates; Moisture; Photovoltaic cells; Polymers; Substrates; Testing;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
  • ISSN
    0160-8371
  • Print_ISBN
    0-7803-8707-4
  • Type

    conf

  • DOI
    10.1109/PVSC.2005.1488178
  • Filename
    1488178