DocumentCode
3557609
Title
Enhanced adhesion of EVA laminates to primed glass substrates subjected to damp heat exposure
Author
Pern, F.J. ; Jorgensen, G.J.
Author_Institution
Nat. Center for Photovoltaics, Nat. Renewable Energy Lab., Golden, CO, USA
fYear
2005
fDate
3-7 Jan. 2005
Firstpage
495
Lastpage
498
Abstract
We investigated the effectiveness of glass-surface priming to promote enhanced adhesion of EVA laminates during damp-heat exposure at 85°C and 85% relative humidity. The primary objective was to develop advanced encapsulant formulations by incorporation of various primer formulations that exhibit improved adhesion during damp-heat exposure. Several primer formulations were identified that greatly enhanced the EVA adhesion strength, including to the extent that peeling could not be initiated, even for the laminates of the glass substrate/fast-cure EVA15295P/TPE backsheet (a Tedlar/polyester/EVA tri-laminate) that were exposed in a damp-heat test chamber for more than 750 h. The results show that a synergistic increase in the interfacial hydrophobicity, siloxane density, and cross-linking density are the key attributes to the improvement in the EVA adhesion strength.
Keywords
adhesion; composite material interfaces; encapsulation; glass; heat treatment; laminates; polymers; substrates; 750 h; 85 degC; EVA laminates; SiO2; TPE backsheet; Tedlar/polyester/EVA tri-laminate; adhesion strength; advanced encapsulant formulations; cross-linking density; damp heat exposure; enhanced adhesion; fast-cure EVA15295P; glass-surface priming; interfacial hydrophobicity; peeling; primed glass substrates; primer formulations; siloxane density; Adhesives; Glass; Humidity; Laboratories; Laminates; Moisture; Photovoltaic cells; Polymers; Substrates; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
ISSN
0160-8371
Print_ISBN
0-7803-8707-4
Type
conf
DOI
10.1109/PVSC.2005.1488178
Filename
1488178
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