DocumentCode :
3557610
Title :
Testing of packaging materials for improved PV module reliability
Author :
Jorgensen, G.J. ; Terwilliger, K.M. ; Kempe, M.D. ; McMahon, T.J.
Author_Institution :
Nat. Renewable Energy Lab., Golden, CO, USA
fYear :
2005
fDate :
3-7 Jan. 2005
Firstpage :
499
Lastpage :
502
Abstract :
A number of candidate alternative encapsulant and soft backsheet materials have been evaluated in terms of their suitability for photovoltaic (PV) module packaging applications. Relevant properties, including interfacial adhesion and moisture transport, have been measured as a function of damp-heat (85°C / 85% relative humidity) exposure. Based on these tests, promising new encapsulants with improved properties have been identified. Backsheets prepared by industry and at NREL have been found to provide varying levels of moisture ingress protection. To achieve significantly improved products, further development of these candidates is ongoing. The relative effectiveness of various packaging strategies to protect PV devices has also been investigated.
Keywords :
adhesion; encapsulation; heat treatment; integrated circuit packaging; materials testing; moisture; photovoltaic cells; semiconductor device packaging; 85 degC; damp-heat exposure; encapsulant; improved PV module reliability; improved photovoltaic module reliability; interfacial adhesion; moisture ingress protection; moisture transport; packaging materials testing; packaging strategies; photovoltaic module packaging applications; soft backsheet materials; Adhesives; Building materials; Corrosion; Glass; Materials reliability; Materials testing; Moisture measurement; Packaging; Protection; Sputtering;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Photovoltaic Specialists Conference, 2005. Conference Record of the Thirty-first IEEE
ISSN :
0160-8371
Print_ISBN :
0-7803-8707-4
Type :
conf
DOI :
10.1109/PVSC.2005.1488179
Filename :
1488179
Link To Document :
بازگشت