High-Density Solder Bump Interconnect for MEMS Hybrid Integration

Author

Basavanhally, Nagesh ; Lopez, Daniel ; Aksyuk, Vladimir ; Ramsey, Dave ; Bower, Eric ; Cirelli, Ray ; Ferry, E. ; Frahm, Robert ; Gates, John, II ; Klemens, Fred ; Lai, Warren ; Low, Yee ; Mansfield, William ; Pai, Chien-Shing ; Papazian, Rick ; Pardo, Fl

Author_Institution

Lucent Technol., Murray

Volume

30

Issue

4

fYear

2007

Firstpage

622

Lastpage

628

Abstract

An ultra high-density hybrid integration for micro-electromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps of selectively removing the silicon handle and releasing the MEMS mirrors. For the first time, to our knowledge, solder deposition and flip-chip bonding of 3-mum bumps on 5-mum centers of a large array has been demonstrated.

Keywords

flip-chip devices; integrated circuit interconnections; micromechanical devices; solders; MEMS mirrors; flip-chip assembly; flip-chip bonding; high-density solder bump; interconnections; microelectromechanical system; mirror chips; solder deposition; ultra high-density hybrid integration; Flip-chip; hybrid assembly; microelectromechanical systems (MEMS) integration; mirror array; mirror release; solder bumps; spatial light modulator (SLM);

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/TADVP.2007.906395

Filename

4358058