Author :
Basavanhally, Nagesh ; Lopez, Daniel ; Aksyuk, Vladimir ; Ramsey, Dave ; Bower, Eric ; Cirelli, Ray ; Ferry, E. ; Frahm, Robert ; Gates, John, II ; Klemens, Fred ; Lai, Warren ; Low, Yee ; Mansfield, William ; Pai, Chien-Shing ; Papazian, Rick ; Pardo, Fl
Abstract :
An ultra high-density hybrid integration for micro-electromechanical system (MEMS) mirror chips with several thousand inputs/outputs has been developed. The integration scheme involving flip-chip assembly provides electrical signal to individual mirrors, which is compatible with postprocessing steps of selectively removing the silicon handle and releasing the MEMS mirrors. For the first time, to our knowledge, solder deposition and flip-chip bonding of 3-mum bumps on 5-mum centers of a large array has been demonstrated.
Keywords :
flip-chip devices; integrated circuit interconnections; micromechanical devices; solders; MEMS mirrors; flip-chip assembly; flip-chip bonding; high-density solder bump; interconnections; microelectromechanical system; mirror chips; solder deposition; ultra high-density hybrid integration; Flip-chip; hybrid assembly; microelectromechanical systems (MEMS) integration; mirror array; mirror release; solder bumps; spatial light modulator (SLM);
