DocumentCode :
3558652
Title :
Enhanced off-state leakage currents in n-channel MOSFETs with N2O-grown gate dielectric
Author :
Xu, Zeng ; Lai, P.T. ; Ng, W.T.
Author_Institution :
Dept. of Electr. & Electron. Eng., Hong Kong Univ., Hong Kong
Volume :
16
Issue :
10
fYear :
1995
Firstpage :
436
Lastpage :
438
Abstract :
This paper reports on the off-state drain (GIDL) and gate current (Ig) characteristics of n-channel MOSFETs using thin thermal oxide (OX), N/sub 2/O-nitrided oxide (N2ON), and N/sub 2/O-grown oxide (N20G) as gate dielectrics. Important phenomena observed in N20G devices are enhanced GIDL and Ig in the low-field region as compared to the OX and N20N devices. They are attributed to heavy-nitridation-induced junction leakage and shallow-electron-trap-assisted tunneling mechanisms, respectively. Therefore, N2ON oxide is superior to N20G oxide in leakage-sensitive applications.<>
Keywords :
MOSFET; dielectric thin films; electron traps; leakage currents; nitridation; semiconductor-insulator boundaries; tunnelling; N/sub 2/O-grown gate dielectric; Si-SiNO; gate dielectrics; heavy-nitridation-induced junction leakage; leakage-sensitive applications; n-channel MOSFET; nitrided oxide; offstate leakage currents; shallow-electron-trap-assisted tunneling mechanisms; thin thermal oxide; Boron; Dielectric devices; Dielectric measurements; Doping; Electrons; Hot carriers; Implants; Leakage current; MOSFET circuits; Tunneling;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/55.464809
Filename :
464809
Link To Document :
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