Characterization of a thermal interface material for burn-in application

Author

Dean, Nancy F. ; Gupta, Anurag

Author_Institution

Honeywell Electron. Mater., Spokane, WA, USA

Volume

1

fYear

2000

fDate

2000

Lastpage

41

Abstract

A series of tests to characterize the suitability of a material as a thermal interface for burn-in applications were generated. These tests include thermal resistance at elevated temperature, thermal resistance as a function of cycle number, mechanical cycling with and without shear, extended high temperature exposure, residue measurements, mechanical compliance measurements, and tensile and shear strength measurements. Results from testing were used to optimize an in house thermal interface material to withstand repetitive burn-in cycles without requiring replacement

Keywords

semiconductor device packaging; semiconductor device reliability; shear strength; tensile strength; thermal resistance; burn-in application; cycle number; extended high temperature exposure; mechanical compliance measurements; mechanical cycling; residue measurements; semiconductor device packaging; shear strength measurements; tensile strength measurements; thermal interface material; thermal resistance; Dielectric materials; Electrical resistance measurement; Heat sinks; Materials testing; Mechanical variables measurement; Packaging; Phase change materials; Semiconductor materials; Temperature measurement; Thermal resistance;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866805

Filename

866805