DocumentCode
355894
Title
Understanding the performance characteristics of phase-change thermal interface materials
Author
Rauch, Bob
Author_Institution
Power Devices Inc., Laguna Hills, CA, USA
Volume
1
fYear
2000
fDate
2000
Lastpage
47
Abstract
To aid in the understanding of phase-change thermal interface materials, the results of characterization testing performed on three currently available materials are discussed. These tests were performed using the methods of ASTM D 5470 modified to account for the properties of phase-change materials. These data reveal that while the materials tested show a variation in performance, they all achieve their minimum thermal impedance values by reducing their thickness and eliminating interfacial contact resistance after phase change. This paper also discusses an example of how to apply the test data to a specific application to predict the interface temperature difference when the interface mechanical specifications, mounting pressure and power density are defined
Keywords
contact resistance; packaging; thermal conductivity; thermal resistance; ASTM D 5470; characterization testing; interface mechanical specifications; interfacial contact resistance; minimum thermal impedance values; mounting pressure; performance characteristics; phase-change thermal interface materials; power density; Conducting materials; Contact resistance; Materials testing; Performance evaluation; Phase change materials; Solids; Surface impedance; Temperature; Thermal conductivity; Thermal resistance;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location
Las Vegas, NV
ISSN
1089-9870
Print_ISBN
0-7803-5912-7
Type
conf
DOI
10.1109/ITHERM.2000.866806
Filename
866806
Link To Document