Title :
Understanding the performance characteristics of phase-change thermal interface materials
Author_Institution :
Power Devices Inc., Laguna Hills, CA, USA
Abstract :
To aid in the understanding of phase-change thermal interface materials, the results of characterization testing performed on three currently available materials are discussed. These tests were performed using the methods of ASTM D 5470 modified to account for the properties of phase-change materials. These data reveal that while the materials tested show a variation in performance, they all achieve their minimum thermal impedance values by reducing their thickness and eliminating interfacial contact resistance after phase change. This paper also discusses an example of how to apply the test data to a specific application to predict the interface temperature difference when the interface mechanical specifications, mounting pressure and power density are defined
Keywords :
contact resistance; packaging; thermal conductivity; thermal resistance; ASTM D 5470; characterization testing; interface mechanical specifications; interfacial contact resistance; minimum thermal impedance values; mounting pressure; performance characteristics; phase-change thermal interface materials; power density; Conducting materials; Contact resistance; Materials testing; Performance evaluation; Phase change materials; Solids; Surface impedance; Temperature; Thermal conductivity; Thermal resistance;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5912-7
DOI :
10.1109/ITHERM.2000.866806