• DocumentCode
    355894
  • Title

    Understanding the performance characteristics of phase-change thermal interface materials

  • Author

    Rauch, Bob

  • Author_Institution
    Power Devices Inc., Laguna Hills, CA, USA
  • Volume
    1
  • fYear
    2000
  • fDate
    2000
  • Lastpage
    47
  • Abstract
    To aid in the understanding of phase-change thermal interface materials, the results of characterization testing performed on three currently available materials are discussed. These tests were performed using the methods of ASTM D 5470 modified to account for the properties of phase-change materials. These data reveal that while the materials tested show a variation in performance, they all achieve their minimum thermal impedance values by reducing their thickness and eliminating interfacial contact resistance after phase change. This paper also discusses an example of how to apply the test data to a specific application to predict the interface temperature difference when the interface mechanical specifications, mounting pressure and power density are defined
  • Keywords
    contact resistance; packaging; thermal conductivity; thermal resistance; ASTM D 5470; characterization testing; interface mechanical specifications; interfacial contact resistance; minimum thermal impedance values; mounting pressure; performance characteristics; phase-change thermal interface materials; power density; Conducting materials; Contact resistance; Materials testing; Performance evaluation; Phase change materials; Solids; Surface impedance; Temperature; Thermal conductivity; Thermal resistance;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
  • Conference_Location
    Las Vegas, NV
  • ISSN
    1089-9870
  • Print_ISBN
    0-7803-5912-7
  • Type

    conf

  • DOI
    10.1109/ITHERM.2000.866806
  • Filename
    866806