Title :
Flow network modeling for improving flow distribution of microelectronics burn-in oven
Author :
Lian, Bin ; Dishongh, Terrance ; Pullen, David ; Yan, Hongfei ; Chen, Jing
Author_Institution :
Intel Corp., Hillsboro, OR, USA
Abstract :
Modern microelectronics, especially high performance microprocessors need to go through rigorous test and stressing to identify infant mortality failure. One of the stressing procedures is performed by running the devices at elevated temperature for prolonged period of time. With the ever faster microprocessor speed and device power, current burn-in solutions will not be enough to accommodate future generation of products. This study investigated the enhancement of local heat transfer by restricting open flow paths and redirection of cooling flow to the burn-in devices, through flow analysis with Flow Network Modeling software. A hierarchical modeling approach was used in which the flow characteristics of burn-in socket were derived, from which the burn-in board model was built, and a system level model was eventually assembled. Case study for a 3×5 burn-in board was conducted using Flow Network Modeling software and numerical results are presented
Keywords :
cooling; heat sinks; heat transfer; integrated circuit packaging; integrated circuit testing; life testing; ovens; production testing; thermal resistance; cooling flow; flow distribution; flow network modeling; hierarchical modeling approach; high performance microprocessors; infant mortality failure; local heat transfer; microelectronics burn-in oven; open flow paths; system level model; Assembly systems; Cooling; Heat transfer; Microelectronics; Microprocessors; Power generation; Power system modeling; Sockets; Temperature; Testing;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5912-7
DOI :
10.1109/ITHERM.2000.866811
