Thermal evaluation and modelling of the SIP9 and SP10 MEMS packages

Author

Rencz, Márta ; Székely, Vladimir ; Kohári, Zsolt ; Courtois, Bernard

Author_Institution

Micred Ltd., Budapest, Hungary

Volume

1

fYear

2000

fDate

2000

Lastpage

126

Abstract

The SIP9 and SP10 packages are cheap plastic packages applicable for a broad range of MEMS applications. They are frequently used for packaging thermally operated MEMS, so knowing the thermal characteristics of the packages is very important. The paper presents an exhaustive thermal analysis of these packages, with various simulation tools and measurements. From the numerous experiments we draw conclusions not only about the thermal behaviour of the packages, but about the comparative features of the applied simulation and measurement tools as well. We compare the effectiveness of 2D and 3D simulation tools, discussing the advantages and drawbacks for the present applications. Both simulation based and measurement based transient thermal compact models are presented and evaluated

Keywords

micromechanical devices; plastic packaging; thermal analysis; thermal management (packaging); 2D simulation; 3D simulation; MEMS device; SIP9; SP10; plastic package; thermal analysis; transient thermal model; Analytical models; Circuit simulation; Electronics packaging; Intelligent sensors; Laboratories; Microelectromechanical systems; Microelectronics; Micromechanical devices; Plastic packaging; Reduced order systems;

fLanguage

English

Publisher

ieee

Conference_Titel

Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on

Conference_Location

Las Vegas, NV

ISSN

1089-9870

Print_ISBN

0-7803-5912-7

Type

conf

DOI

10.1109/ITHERM.2000.866817

Filename

866817