• DocumentCode
    3559128
  • Title

    AlGaN/GaN High Electron Mobility Transistor Structures: Self-Heating Effect and Performance Degradation

  • Author

    Vitusevich, Svetlana A. ; Kurakin, Andrey M. ; Klein, Norbert ; Petrychuk, Mykhailo V. ; Naumov, Andrey V. ; Belyaev, Alexander E.

  • Author_Institution
    Forschungszentrum Juelich, Julich
  • Volume
    8
  • Issue
    3
  • fYear
    2008
  • Firstpage
    543
  • Lastpage
    548
  • Abstract
    This paper reports on the results of the experimental and numerical investigation into the self-heating effect in AlGaN/GaN heterostructures grown on sapphire and SiC substrates. It shows that temperature increase has an opposite dependence on the buffer thickness for sapphire and SiC substrates. Noise spectroscopy is also used to monitor the self-heating effect. Moreover, it is shown that the room-temperature spectra can be used to determine the activation energy of the traps. An irreversible improvement in mobility and quantum scattering time is registered after the irradiation of AlGaN/GaN heterostructures at a total dose of 1 times106 rad of 60Co gamma rays.
  • Keywords
    III-V semiconductors; aluminium compounds; buffer layers; gallium compounds; gamma-ray effects; high electron mobility transistors; semiconductor device models; semiconductor device noise; semiconductor heterojunctions; wide band gap semiconductors; 60Co gamma ray irradiation; Al2O3; AlGaN-GaN; SiC; buffer thickness; high electron mobility transistor structure; noise spectroscopy; quantum scattering time; radiation absorbed dose 1000000 rad; sapphire substrate; self-heating effect; semiconductor heterostructure; temperature 293 K to 298 K; trap activation energy; Aluminum gallium nitride; Degradation; Gallium nitride; HEMTs; MODFETs; Monitoring; Particle scattering; Silicon carbide; Spectroscopy; Temperature dependence; Heating; high-electron mobility transistors (HEMTs); noise measurement; reliability; spectroscopy;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2008.2001684
  • Filename
    4655589