Title :
Use of zero thickness conducting plate object in electronics cooling applications of CFD
Author :
Karimanal, Kamal ; Nair, Rajesh
Author_Institution :
Fluent Inc., Lebanon, NH, USA
Abstract :
Zero thickness conducting plates are CFD objects that may be used to model 3 dimensional conduction in thin objects used in electronic cooling applications. The use of zero thickness conducting plates, when applicable can result in significant reduction in finite volume element count. The validity of using these thin conducting plates for CFD modeling of certain objects frequently used in electronic systems was studied using ICEPAK, a CFD software for electronics cooling application
Keywords :
computational fluid dynamics; cooling; finite element analysis; heat conduction; thermal management (packaging); CFD software; ICEPAK; electronic cooling; finite element model; three-dimensional heat conduction; zero thickness conducting plate object; Application software; Boundary conditions; Computational fluid dynamics; Economic forecasting; Electronics cooling; Heat sinks; Insulation; Power generation economics; Predictive models; Temperature;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 2000. ITHERM 2000. The Seventh Intersociety Conference on
Conference_Location :
Las Vegas, NV
Print_ISBN :
0-7803-5912-7
DOI :
10.1109/ITHERM.2000.866841
