DocumentCode
3559548
Title
Design and Fabrication of MJTCs on Quartz Substrates at NIST
Author
Scarioni, Luciana ; Lipe, Thomas E. ; Kinard, Joseph R.
Author_Institution
Dept. de Fis., Univ. de Carabobo, Valencia
Volume
58
Issue
4
fYear
2009
fDate
4/1/2009 12:00:00 AM
Firstpage
868
Lastpage
871
Abstract
Wet and dry etching is employed in the fabrication of new planar thin-film multijunction thermal converters (MJTCs) on quartz membranes and crystalline quartz chips at the National Institute of Standards and Technology (NIST). The use of crystalline quartz as a material for the membrane and chip improves the performance of the MJTC in the frequency range of 100 kHz-100 MHz. Simulations of the ac-dc voltage transfer difference for a heater resistance of 400 Omega in the frequency range of 1-100 MHz show a reduction in the ac-dc transfer difference of more than one order of magnitude, in comparison with the MJTCs fabricated on silicon chips. The devices that have been fabricated, although not optimized for 100 MHz, have been shown to have reasonable performance for their 20-V maximum input.
Keywords
AC-DC power convertors; etching; thin film circuits; National Institute of Standards and Technology; ac-dc voltage transfer difference; dry etching; frequency 100 kHz to 100 MHz; heater resistance; quartz substrates; resistance 400 ohm; silicon chip fabrication; voltage 20 V; wet etching; Ac–dc difference; Ac–dc difference; ac voltage; multijunction thermal converter (MJTC); quartz wafers; thermal voltage converter; voltage metrology;
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
Conference_Location
12/12/2008 12:00:00 AM
ISSN
0018-9456
Type
jour
DOI
10.1109/TIM.2009.2008596
Filename
4711127
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