DocumentCode :
3560336
Title :
Self-Assembly of Millimeter-Scale Components Using Integrated Micromagnets
Author :
Shetye, Sheetal B. ; Eskinazi, Ilan ; Arnold, David P.
Author_Institution :
Interdiscipl. Microsyst. Group, Univ. of Florida, Gainesville, FL
Volume :
44
Issue :
11
fYear :
2008
Firstpage :
4293
Lastpage :
4296
Abstract :
This paper demonstrates and characterizes magnetically-directed self-assembly of 1 mm times 1 mm times 500 mum silicon components into an ordered array on a planar substrate. Each silicon component includes an embedded, microfabricated magnet on one surface that bonds to a corresponding magnetic receptor site (another embedded magnet) on the substrate. Two different magnet sizes are explored, corresponding to 25% and 75% of the bonding surface area. Using a shaker apparatus for mixing in a dry environment, studies are conducted to determine the assembly rates and yields. For the smaller magnets, a 4 times 4 array of components is shown to assemble onto a substrate with 97.5% yield in 10 s. The larger magnets indicate a 98.7% yield in 7 s.
Keywords :
bonding processes; elemental semiconductors; magnetic devices; magnetic semiconductors; microfabrication; micromagnetics; permanent magnets; self-assembly; silicon; wafer bonding; Si; integrated micromagnets; magnetic receptor site; millimeter-scale components; mixing; permanent magnets; planar substrate; self-assembly; shaker apparatus; silicon component; surface area wafer bonding; time 10 s; time 7 s; Embedded magnets; hard magnets; magnetic self-assembly; micromagnets;
fLanguage :
English
Journal_Title :
Magnetics, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9464
Type :
jour
DOI :
10.1109/TMAG.2008.2001344
Filename :
4717697
Link To Document :
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