• DocumentCode
    3561205
  • Title

    High-Performance Solenoidal RF Transformers on High-Resistivity Silicon Substrates for 3D Integrated Circuits

  • Author

    Feng, Zhiping ; Lueck, Matthew R. ; Temple, Dorota S. ; Steer, Michael B.

  • Author_Institution
    Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
  • Volume
    60
  • Issue
    7
  • fYear
    2012
  • fDate
    7/1/2012 12:00:00 AM
  • Firstpage
    2066
  • Lastpage
    2072
  • Abstract
    Soleniod-like transformers based on a traveling-wave design and using advanced through silicon via process technology are reported for operation at frequencies from 1 to 14 GHz. The symmetrical 1:1 transformers are designed as compact slow-wave transmission-line structures with well-defined signal return paths. One-, two-, three-, and four-turn transformers have 1-dB bandwidths ranging from 6 to 9.2 GHz, and midband insertion losses from 0.24 to 0.37 dB. The measured intrinsic loss is 0.46 dB or less up to 10 GHz, and 0.97 dB up to 14 GHz. Relatively simple and scalable physically based lumped-element circuit models accurately predict the performance of these low parasitic transformers.
  • Keywords
    high-frequency transformers; losses; lumped parameter networks; microwave integrated circuits; slow wave structures; solenoids; three-dimensional integrated circuits; 3D integrated circuit; Si; bandwidth 6 GHz to 9.2 GHz; compact slow-wave transmission-line structure; four-turn transformer; frequency 1 GHz to 14 GHz; gain 1 dB; high-performance solenoidal RF transformer; high-resistivity silicon substrates; intrinsic loss measurement; loss 0.24 dB to 0.37 dB; loss 0.46 dB; loss 0.97 dB; low parasitic transformer; lumped-element circuit model; midband insertion loss; one-turn transformer; three-turn transformer; through silicon via process technology; traveling-wave design; two-turn transformer; well-defined signal return path; Conductivity; Copper; Power transformer insulation; Radio frequency; Silicon; Substrates; Transmission line measurements; 3D integrated circuit (3DIC); Heterogeneous integration; RF transformer; slow-wave structure; through silicon via (TSV);
  • fLanguage
    English
  • Journal_Title
    Microwave Theory and Techniques, IEEE Transactions on
  • Publisher
    ieee
  • Conference_Location
    5/10/2012 12:00:00 AM
  • ISSN
    0018-9480
  • Type

    jour

  • DOI
    10.1109/TMTT.2012.2195026
  • Filename
    6198417