DocumentCode
3561205
Title
High-Performance Solenoidal RF Transformers on High-Resistivity Silicon Substrates for 3D Integrated Circuits
Author
Feng, Zhiping ; Lueck, Matthew R. ; Temple, Dorota S. ; Steer, Michael B.
Author_Institution
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Volume
60
Issue
7
fYear
2012
fDate
7/1/2012 12:00:00 AM
Firstpage
2066
Lastpage
2072
Abstract
Soleniod-like transformers based on a traveling-wave design and using advanced through silicon via process technology are reported for operation at frequencies from 1 to 14 GHz. The symmetrical 1:1 transformers are designed as compact slow-wave transmission-line structures with well-defined signal return paths. One-, two-, three-, and four-turn transformers have 1-dB bandwidths ranging from 6 to 9.2 GHz, and midband insertion losses from 0.24 to 0.37 dB. The measured intrinsic loss is 0.46 dB or less up to 10 GHz, and 0.97 dB up to 14 GHz. Relatively simple and scalable physically based lumped-element circuit models accurately predict the performance of these low parasitic transformers.
Keywords
high-frequency transformers; losses; lumped parameter networks; microwave integrated circuits; slow wave structures; solenoids; three-dimensional integrated circuits; 3D integrated circuit; Si; bandwidth 6 GHz to 9.2 GHz; compact slow-wave transmission-line structure; four-turn transformer; frequency 1 GHz to 14 GHz; gain 1 dB; high-performance solenoidal RF transformer; high-resistivity silicon substrates; intrinsic loss measurement; loss 0.24 dB to 0.37 dB; loss 0.46 dB; loss 0.97 dB; low parasitic transformer; lumped-element circuit model; midband insertion loss; one-turn transformer; three-turn transformer; through silicon via process technology; traveling-wave design; two-turn transformer; well-defined signal return path; Conductivity; Copper; Power transformer insulation; Radio frequency; Silicon; Substrates; Transmission line measurements; 3D integrated circuit (3DIC); Heterogeneous integration; RF transformer; slow-wave structure; through silicon via (TSV);
fLanguage
English
Journal_Title
Microwave Theory and Techniques, IEEE Transactions on
Publisher
ieee
Conference_Location
5/10/2012 12:00:00 AM
ISSN
0018-9480
Type
jour
DOI
10.1109/TMTT.2012.2195026
Filename
6198417
Link To Document