DocumentCode
3561762
Title
A multilayer active hybrid-ring using ground-slot coupling technique
Author
Hui, S.C. ; Ban-Leong Ooi ; Leong, M.S. ; Kooi, P.S.
Author_Institution
Dept. of Electr. & Comput. Eng., Nat. Univ. of Singapore, Singapore
Volume
1
fYear
2003
Abstract
A ground-slot coupling technique is applied to design a novel multilayer active hybrid-ring power divider. The prototype consists of three ground slots to couple the signal between circuit layers, and two single-stage HEMT amplifiers to boost the coupled signal. It is tested at C-band with 40% -3dB bandwidth. At 5 GHz center frequency, it has 8 dB small-signal gain and 10 dBm output P1 dB.
Keywords
HEMT circuits; active networks; impedance matching; microstrip circuits; microwave amplifiers; microwave circuits; power dividers; printed circuits; 5 GHz; 8 dB; C-band; PCB; active hybrid-ring power divider; ground-slot coupling technique; multilayer active power divider; single-stage HEMT amplifiers; Apertures; Bandwidth; Broadband amplifiers; Circuit testing; Coupling circuits; Microstrip; Nonhomogeneous media; Power dividers; Prototypes; Shape;
fLanguage
English
Publisher
ieee
Conference_Titel
Microwave Symposium Digest, 2003 IEEE MTT-S International
ISSN
0149-645X
Print_ISBN
0-7803-7695-1
Type
conf
DOI
10.1109/MWSYM.2003.1211053
Filename
1211053
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