DocumentCode :
3563265
Title :
Upgrading the engineering curriculum through thematic learning modules
Author :
Khan, Fazeel ; Singh, Kumar V.
Author_Institution :
Mech. & Manuf. Eng. Dept., Miami Univ., Oxford, OH, USA
fYear :
2014
Firstpage :
1
Lastpage :
4
Abstract :
A National Science Foundation (NSF) sponsored project was initiated in 2011 at the Department of Mechanical and Manufacturing Engineering (MME), Miami University, with the aim of creating online learning modules to increase the efficacy of the coursework. The modules were designed to instil proficiency in computational and experimental analysis, and were grouped along five thematic lines in the form of subject studios. The modules contain multimedia content and are designed for use as supplementary course material, or independently by students in preparation for research tasks or review of specific concepts from prior courses. When used to augment existing courses, a salient feature of the modules is the ability to introduce lab/experiment derived content to lecture-only course formats. This has been found to be particularly effective in engaging students and enabling the introduction of new topics with minimal disruption to the existing daily syllabus of a course. The project´s development and implementation phase will end mid-year. Since assessment and continuous improvement were integral parts of the project, this paper presents data from the two year assessment process and describes the changes to the project. The paper also includes a discussion of plans for expansion of modules and practices for keeping content current.
Keywords :
computer aided instruction; educational courses; engineering education; mechanical engineering computing; engineering curriculum; online learning; thematic learning module; Conferences; Educational institutions; Materials; Springs; Vibrations; Learning modules; experimentation; online learning environment; simulation methods;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Frontiers in Education Conference (FIE), 2014 IEEE
Type :
conf
DOI :
10.1109/FIE.2014.7044289
Filename :
7044289
Link To Document :
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