Title :
High-resolution Cardo polymer dielectric "VPA-series"
Author :
Mizuuchi, Kazuhiko ; Kawasato, Hironobu ; Takeuchi, Masahiko ; Inaba, Sinji ; Teramoto, Takero
Author_Institution :
Electron. Mater. R&D Labs., Nippon Steel Chem. Co. Ltd., Chiba, Japan
fDate :
6/24/1905 12:00:00 AM
Abstract :
Nippon Steel Chemical Co., Ltd. has developed a "Cardo" structure polymer based dielectric VPA-series. "Cardo" structure is characterized as bulky substituents attached to the sp3 carbon in polymer backbone. We achieved excellent heat resistance as an acrylic polymer by adopting fluorene as bulky substituent. We have designed a photoimageable dielectric using this polymer. This dielectric has excellent resolution (via-hole opening aspect ratio >1 for a wide thickness range) and high reliability together with heat resistance. This paper introduces characteristics of the polymer itself and featured as dielectric for both printed wiring board (PWB) and wafer level package (WLP) applications. Varnish type and dry film resist (DFR) types are available.
Keywords :
circuit reliability; dielectric thin films; image resolution; integrated circuit packaging; photolithography; polymer films; printed circuits; Cardo structure polymer based dielectric; VPA-series Cardo polymer dielectric; acrylic polymer; bulky substituent attachment; dielectric resolution; dry film resist type dielectric; fluorene bulky substituent; heat resistance; photoimageable dielectric; polymer backbone; polymer characteristics; printed wiring board dielectric; reliability; sp3 carbon; thickness range; varnish type dielectric; via-hole opening aspect ratio; wafer level package dielectric; Chemicals; Dielectrics; Packaging; Polymers; Resistance heating; Resists; Spine; Steel; Wafer scale integration; Wiring;
Conference_Titel :
Electronic Components and Technology Conference, 2002. Proceedings. 52nd
Print_ISBN :
0-7803-7430-4
DOI :
10.1109/ECTC.2002.1008211
