• DocumentCode
    3563660
  • Title

    High-resolution Cardo polymer dielectric "VPA-series"

  • Author

    Mizuuchi, Kazuhiko ; Kawasato, Hironobu ; Takeuchi, Masahiko ; Inaba, Sinji ; Teramoto, Takero

  • Author_Institution
    Electron. Mater. R&D Labs., Nippon Steel Chem. Co. Ltd., Chiba, Japan
  • fYear
    2002
  • fDate
    6/24/1905 12:00:00 AM
  • Firstpage
    924
  • Lastpage
    930
  • Abstract
    Nippon Steel Chemical Co., Ltd. has developed a "Cardo" structure polymer based dielectric VPA-series. "Cardo" structure is characterized as bulky substituents attached to the sp3 carbon in polymer backbone. We achieved excellent heat resistance as an acrylic polymer by adopting fluorene as bulky substituent. We have designed a photoimageable dielectric using this polymer. This dielectric has excellent resolution (via-hole opening aspect ratio >1 for a wide thickness range) and high reliability together with heat resistance. This paper introduces characteristics of the polymer itself and featured as dielectric for both printed wiring board (PWB) and wafer level package (WLP) applications. Varnish type and dry film resist (DFR) types are available.
  • Keywords
    circuit reliability; dielectric thin films; image resolution; integrated circuit packaging; photolithography; polymer films; printed circuits; Cardo structure polymer based dielectric; VPA-series Cardo polymer dielectric; acrylic polymer; bulky substituent attachment; dielectric resolution; dry film resist type dielectric; fluorene bulky substituent; heat resistance; photoimageable dielectric; polymer backbone; polymer characteristics; printed wiring board dielectric; reliability; sp3 carbon; thickness range; varnish type dielectric; via-hole opening aspect ratio; wafer level package dielectric; Chemicals; Dielectrics; Packaging; Polymers; Resistance heating; Resists; Spine; Steel; Wafer scale integration; Wiring;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference, 2002. Proceedings. 52nd
  • ISSN
    0569-5503
  • Print_ISBN
    0-7803-7430-4
  • Type

    conf

  • DOI
    10.1109/ECTC.2002.1008211
  • Filename
    1008211