DocumentCode

3564365

Title

Vibration fatigue reliability of BGA-IC package with Pb-free solder and Pb-Sn solder

Author

Kim, Young-Bae ; Noguchi, Hiroshi ; Amagai, Masazumi

Author_Institution

Kyushu University

fYear

2003

Firstpage

891

Lastpage

897

Keywords

Electronics packaging; Failure analysis; Fatigue; Frequency; Microelectronics; Optical microscopy; Stress; Temperature; Testing; Vibrations;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference, 2003. Proceedings. 53rd

ISSN

0569-5503

Print_ISBN

0-7803-7791-5

Type

conf

DOI

10.1109/ECTC.2003.1216397

Filename

1216397