Title :
A modified button-shear method for measuring fracture toughness of polymer-metal interfaces in IC packages
Author :
Tay, A.A.O. ; Phang, J.S. ; Wong, E.H. ; Ranjan, R.
Author_Institution :
National University of Singapore
Keywords :
Adhesives; Delamination; Electronic packaging thermal management; Integrated circuit packaging; Moisture measurement; Particle measurements; Polymers; Shearing; Temperature; Testing;
Conference_Titel :
Electronic Components and Technology Conference, 2003. Proceedings. 53rd
Print_ISBN :
0-7803-7791-5
DOI :
10.1109/ECTC.2003.1216439
