• DocumentCode
    3564557
  • Title

    THz on-wafer calibration using offset-shorts and known through as standards

  • Author

    Caglayan, Cosan ; Trichopoulos, Georgios C. ; Sertel, Kubilay

  • Author_Institution
    ElectroScience Lab., Ohio State Univ., Columbus, OH, USA
  • fYear
    2014
  • Firstpage
    308
  • Lastpage
    309
  • Abstract
    We present a novel on-wafer calibration technique using well-defined standards that can be an alternative to widely used multiline-TRL (thru-reflect-line) calibration in millimeter and submillimeter waves. Our method is specifically useful in measurement setups with fixed probes since TRL-type calibration typically requires different physical separation between measurement probes. As on-wafer standards, offset shorts with different electrical delay lengths and a simple through connection are used. Experimental validation of this calibration method is provided in G-Band (140-220 GHz) via measurement of a Beatty standard (mismatched thru) using non-contact probes.
  • Keywords
    calibration; millimetre wave devices; submillimetre wave devices; terahertz wave devices; Beatty standard; G-band; electrical delay lengths; frequency 140 GHz to 220 GHz; measurement probes; multiline-TRL; noncontact probes; offset-shorts; on-wafer calibration technique; on-wafer standards; physical separation; submillimeter waves; thru-reflect-line calibration; Biomedical measurement; Calibration; Integrated circuit modeling; Mathematical model; Probes; Semiconductor device measurement; Standards; millimeter waves; on-wafer measurements; sub-millimeter waves; terahertz;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Aerospace and Electronics Conference, NAECON 2014 - IEEE National
  • Print_ISBN
    978-1-4799-4690-7
  • Type

    conf

  • DOI
    10.1109/NAECON.2014.7045823
  • Filename
    7045823