• DocumentCode
    3564573
  • Title

    Out of plane motion of assembled microstructures using a single-mask SOI process

  • Author

    Last, M. ; Subramaniam, V. ; Pister, K.S.J.

  • Author_Institution
    Berkeley Sensor & Actuator Center, California Univ., Berkeley, CA, USA
  • Volume
    1
  • fYear
    2005
  • Firstpage
    684
  • Abstract
    We demonstrate out-of-plane motion of microstructures assembled from parts fabricated in a single-mask silicon-on-insulator (SOI) process. Compliant microgrippers used during assembly, in-plane electrostatic actuators, sockets and rotation mechanisms are all defined in the same mask. Advantages of this process include high fabrication yield and very quick fabrication time. We further report on three accomplishments: (1) new rigid sockets, (2) compliant, nonelectrically-actuated microgrippers that pick up parts and automatically rotate them 90° out-of-plane, and (3) out-of-plane rotation of assembled structures using in-plane electrostatic actuators, demonstrating 17° of static mechanical rotation to date.
  • Keywords
    electrostatic actuators; silicon-on-insulator; SOI process; assembled microstructures; fabrication time; fabrication yield; in-plane electrostatic actuators; microgrippers; nonelectrically-actuated microgrippers; out of plane motion; rigid sockets; single-mask SOI process; single-mask silicon-on-insulator; static mechanical rotation; Assembly; Electrostatic actuators; Etching; Fabrication; Grippers; Micromechanical devices; Microstructure; Probes; Silicon on insulator technology; Sockets;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
  • Print_ISBN
    0-7803-8994-8
  • Type

    conf

  • DOI
    10.1109/SENSOR.2005.1496509
  • Filename
    1496509