DocumentCode
3564573
Title
Out of plane motion of assembled microstructures using a single-mask SOI process
Author
Last, M. ; Subramaniam, V. ; Pister, K.S.J.
Author_Institution
Berkeley Sensor & Actuator Center, California Univ., Berkeley, CA, USA
Volume
1
fYear
2005
Firstpage
684
Abstract
We demonstrate out-of-plane motion of microstructures assembled from parts fabricated in a single-mask silicon-on-insulator (SOI) process. Compliant microgrippers used during assembly, in-plane electrostatic actuators, sockets and rotation mechanisms are all defined in the same mask. Advantages of this process include high fabrication yield and very quick fabrication time. We further report on three accomplishments: (1) new rigid sockets, (2) compliant, nonelectrically-actuated microgrippers that pick up parts and automatically rotate them 90° out-of-plane, and (3) out-of-plane rotation of assembled structures using in-plane electrostatic actuators, demonstrating 17° of static mechanical rotation to date.
Keywords
electrostatic actuators; silicon-on-insulator; SOI process; assembled microstructures; fabrication time; fabrication yield; in-plane electrostatic actuators; microgrippers; nonelectrically-actuated microgrippers; out of plane motion; rigid sockets; single-mask SOI process; single-mask silicon-on-insulator; static mechanical rotation; Assembly; Electrostatic actuators; Etching; Fabrication; Grippers; Micromechanical devices; Microstructure; Probes; Silicon on insulator technology; Sockets;
fLanguage
English
Publisher
ieee
Conference_Titel
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN
0-7803-8994-8
Type
conf
DOI
10.1109/SENSOR.2005.1496509
Filename
1496509
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