Title :
An in-situ technique for measuring Young´s modulus and residual stress of each layer for multi-layer film
Author :
Nie, Meng ; Huang, Qing-An ; Li, Weihua ; Rong, Hua
Author_Institution :
Key Lab. of MEMS of Minist. of Educ., Southeast Univ., Nanjing, China
Abstract :
The paper presents an approach to characterize the material properties of multi-layered films using the electrostatic pull-in test structure. The structure is composed of a multi-layered fixed-fixed beam with different widths. An analytical model for the pull-in voltage of the multi-layered fixed-fixed beam with different widths is first presented. The model is then fitted using numerical analysis to improve its accuracy further. Based on this model, a novel in-situ method for simultaneously extracting Young´s modulus and the residual stress of each layer for the multi-layered films is reported. Validation and accuracy of the extracting method have been confirmed by FEM simulation and experiments.
Keywords :
Young´s modulus; elastic moduli measurement; electrostatic actuators; internal stresses; micromachining; micromechanical devices; multilayers; stress measurement; thin films; MEMS devices; Young modulus measurement; electrostatic pull-in test structure; material properties; multi-layer film; multi-layered fixed-fixed beam; pull-in voltage; residual stress measurement; surface micromachining technology; Actuators; Analytical models; Electrostatics; Material properties; Mechanical sensors; Permittivity; Residual stresses; Sensor phenomena and characterization; Stress measurement; Voltage;
Conference_Titel :
Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. The 13th International Conference on
Print_ISBN :
0-7803-8994-8
DOI :
10.1109/SENSOR.2005.1496547
