DocumentCode
356481
Title
Optical backplanes
Author
Plant, D.V.
Author_Institution
Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, Que., Canada
Volume
3
fYear
2000
fDate
7-10 March 2000
Firstpage
145
Abstract
This paper discusses short-distance optical interconnects for distributed digital systems. We describe two-dimensional parallel optical interconnect technologies with provide connectivity across packaging layers, including chips on boards, boards in backplanes, and shelves within a bay.
Keywords
integrated circuit packaging; optical backplanes; boards in backplanes; chips on boards; connectivity; distributed digital systems; optical backplanes; packaging layers; short-distance optical interconnects; two-dimensional parallel optical interconnect technologies; Backplanes; Digital systems; Hardware; Integrated circuit interconnections; Optical arrays; Optical interconnections; Optical transmitters; Packaging; Stimulated emission; Vertical cavity surface emitting lasers;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication Conference, 2000
Conference_Location
Baltimore, MD, USA
Print_ISBN
1-55752-630-3
Type
conf
DOI
10.1109/OFC.2000.868547
Filename
868547
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