Title :
600 V JEDEC-qualified highly reliable GaN HEMTs on Si substrates
Author :
Kikkawa, Toshihide ; Hosoda, Tsutomu ; Imanishi, Kenji ; Shono, Ken ; Itabashi, Kazuo ; Ogino, Tsutomu ; Miyazaki, Yasumori ; Mochizuki, Akitoshi ; Kiuchi, Kenji ; Kanamura, Masahito ; Kamiyama, Masamichi ; Akiyama, Shiniichi ; Kawasaki, Susumu ; Maeda, T
Author_Institution :
Transphorm Japan Inc., Aizu-Wakamatsu, Japan
Abstract :
In this paper, we demonstrate 600 V highly reliable GaN high electron mobility transistors (HEMTs) on Si substrates. GaN on Si technologies are most important for the mass-production at the Si-LSI manufacturing facility. High breakdown voltage over 1500 V was confirmed with stable dynamic on-resistance (RON) using cascode configuration package. These GaN HEMT on Si based cascode packages have passed the qualification based on the standards of the Joint Electron Devices Engineering Council (JEDEC) (1-5) for the first time. High voltage acceleration test was performed up to 1150 V. Even considering most conservative failure mechanism, mean time to failure (MTTF) of over 1×107 hours at 600 V was predicted at 80°C. Additional conclusion is that conventional packages such as TO-220 are still suitable for high speed circuit application without using a specific gate driver. Ultimately GaN will significantly reduce conversion losses endemic in all areas of electricity conversion, ranging from power supplies to PV inverters to motion control to electric vehicles, enabling consumers, utilities and governments to contribute towards a more energy efficient world.
Keywords :
high electron mobility transistors; power transistors; semiconductor device breakdown; semiconductor device reliability; GaN-Si; JEDEC 1-5; JEDEC qualified HEMT; Joint Electron Devices Engineering Council; cascode configuration package; high electron mobility transistor; highly reliable HEMT; voltage 1150 V; voltage 600 V; Gallium nitride; HEMTs; Logic gates; MODFETs; Reliability; Silicon; Temperature measurement;
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
DOI :
10.1109/IEDM.2014.7046968