Title :
Vth adjustable self-aligned embedded source/drain Si/Ge nanowire FETs and dopant-free NVMs for 3D sequentially integrated circuit
Author :
Chih-Chao Yang ; Jia-Min Shieh ; Tung-Ying Hsieh ; Wen-Hsien Huang ; Hsing-Hsiang Wang ; Chang-Hong Shen ; Tsung-Ta Wu ; Chun-Yuan Chen ; Kuei-Shu Chang-Liao ; Jung-Hau Shiu ; Meng-Chyi Wu ; Fu-Liang Yang
Author_Institution :
Nat. Nano Device Labs., Hsinchu, Taiwan
Abstract :
3D stackable high-performance Si nanowire field-effect transistors (NWFETs) and dopant-free Ge junctionless nanowire non-volatile memories (JL-NWNVMs) with self-aligned embedded source/drain (S/D) current boosters and independent back gate (BG) Vth adjusters for 3D sequential integrated circuit are realized by low thermal budget process (<;450°C). The fabricated Si NWFETs exhibit low subthreshold swings (96 and 125 mV/dec.), high on-currents (232 and 110 μA/μm), and large γ value (>0.05) for Vth adjustment. The high-Δ capped blocking dielectric bandgap engineered dopant-free Ge JL-NWNVM exhibits high Ion/Ioff ratio (>105), large memory window (>4V), and low charge loss (<;40%, 10yrs). Thanks to the quantum confinement effect, such Vth adjustable nanowire devices perform well at higher temperatures, which give a wide design window for 3D sequential integrated circuit.
Keywords :
MOS memory circuits; MOSFET; elemental semiconductors; germanium; nanowires; random-access storage; semiconductor quantum wires; sequential circuits; silicon; three-dimensional integrated circuits; 3D sequentially integrated circuit; BG Vth adjusters; JL-NWNVM; NWFET; S-D current boosters; Si-Ge; dopant-free NVM; high-κ capped blocking dielectric bandgap; independent back gate; junctionless nanowire nonvolatile memories; low thermal budget process; nanowire FET; nanowire field-effect transistors; quantum confinement effect; self-aligned embedded source-drain; Integrated circuits; Lasers; Logic gates; Nanoscale devices; Nonvolatile memory; Silicon; Three-dimensional displays;
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
DOI :
10.1109/IEDM.2014.7047063