• DocumentCode
    3565152
  • Title

    Circuit and device interactions for 3D integration using inductive coupling

  • Author

    Kuroda, Tadahiro

  • Author_Institution
    Keio Univ., Yokohama, Japan
  • fYear
    2014
  • Abstract
    This paper presents a ThruChip Interface using inductive coupling and Highly Doped Silicon Via for power delivery. Design automation, manufacturability, applications, and scaling scenario are discussed.
  • Keywords
    electromagnetic coupling; electromagnetic induction; silicon; three-dimensional integrated circuits; 3D integration; ThruChip interface; design automation; highly doped silicon via; inductive coupling; manufacturability; power delivery; CMOS integrated circuits; Coils; Couplings; Random access memory; Stacking; Three-dimensional displays; Wireless communication;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electron Devices Meeting (IEDM), 2014 IEEE International
  • Type

    conf

  • DOI
    10.1109/IEDM.2014.7047079
  • Filename
    7047079
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3565152