DocumentCode
3565158
Title
A novel double-trapping BE-SONOS charge-trapping NAND flash device to overcome the erase saturation without using curvature-induced field enhancement effect or high-K (HK)/metal gate (MG) materials
Author
Hang-Ting Lue ; Lo, Roger ; Chih-Chang Hsieh ; Pei-Ying Du ; Chih-Ping Chen ; Tzu-Hsuan Hsu ; Kuo-Ping Chang ; Yen-Hao Shih ; Chih-Yuan Lu
Author_Institution
Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
fYear
2014
Abstract
Erase saturation issue is a fundamental challenge for SONOS-type charge-trapping NAND Flash devices. Nowadays the most popular way to solve this issue is to pursue either curvature-induced field enhancement effect in the nano-wire SONOS device, or HK/MG to suppress the gate injection. However, both approaches have its drawback and reliability challenges. In this work, we propose a completely different approach that utilizes a double-trapping (or double storage) layer in a barrier engineered (BE) SONOS device to overcome the erase saturation ideally. A second nitride trapping layer (N3) is stacked on top of the first blocking oxide (O3) and 1st trapping layer (N2) of the original BE-SONOS device. Both theoretical model and experimental measured results indicate that when N3 stores sufficient electron charge it can greatly suppress gate injection, allowing continuous hole injection into N2 that gives a very deep erased Vt ~ -6V. A fully-integrated 3D Vertical Gate (VG) NAND Flash test chip using this novel device has been fabricated which demonstrates excellent MLC operation window and reliability. The flat and planar topology of this double-trapping BE-SONOS device enables minimal design rule of 3D NAND Flash array and possesses superb read disturb immunity.
Keywords
NAND circuits; charge injection; integrated circuit design; integrated circuit reliability; integrated circuit testing; integrated logic circuits; three-dimensional integrated circuits; 3D NAND flash array; MLC operation window; double-trapping BE-SONOS charge-trapping NAND Flash Device; electron charge; erase saturation; flat planar topology; fully-integrated 3D Vertical Gate NAND flash test chip; hole injection; nitride trapping layer; reliability; Capacitors; Electron traps; Interference; Logic gates; Programming; Transient analysis;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2014 IEEE International
Type
conf
DOI
10.1109/IEDM.2014.7047085
Filename
7047085
Link To Document