Title :
On the microscopic structure of hole traps in pMOSFETs
Author :
Grasser, T. ; Goes, W. ; Wimmer, Y. ; Schanovsky, F. ; Rzepa, G. ; Waltl, M. ; Rott, K. ; Reisinger, H. ; Afanas´ev, V.V. ; Stesmans, A. ; El-Sayed, A.-M. ; Shluger, A.L.
Author_Institution :
Tech. Univ. Wien, Vienna, Austria
Abstract :
Hole trapping in the gate insulator of pMOS transistors has been linked to a wide range of detrimental phenomena, including random telegraph noise (RTN), 1/ f noise, negative bias temperature instability (NBTI), stress-induced leakage currents (SILC) and hot carrier degradation. Since the dynamics of hole trapping appear similar in various oxides such as pure SiO2, SiON, and high-k, the responsible defects should have a related microscopic structure. While a number of defects have been suspected to be responsible for these phenomena, such as oxygen vacancies/E´ centers, K centers, hydrogen bridges or hydrogen-related defects in general, the chemical nature of the dominant charge trap remains controversial. Based on extended time-dependent defect spectroscopy (TDDS) data, we investigate the statistical properties of a number of defect candidates using density functional theory (DFT) calculations. Our results suggest hydrogen bridges and hydroxyl E´ centers to be very likely candidates.
Keywords :
MOSFET; density functional theory; hole traps; hot carriers; leakage currents; negative bias temperature instability; vacancies (crystal); 1- f noise; DFT calculations; K centers; NBTI; RTN; SILC; density functional theory calculations; dominant charge trap; extended TDDS data; extended time-dependent defect spectroscopy data; gate insulator; hole trapping; hot carrier degradation; hydrogen bridges; hydrogen-related defects; hydroxyl E´ centers; negative bias temperature instability; oxygen vacancies; pMOS transistors; random telegraph noise; statistical properties; stress-induced leakage currents; Bridges; Correlation; Discrete Fourier transforms; Energy states; Hydrogen; Logic gates; Silicon;
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
DOI :
10.1109/IEDM.2014.7047093