A monolithic 9 degree of freedom (DOF) capacitive inertial MEMS platform

Author

Ocak, Ilker E. ; Cheam, Daw D. ; Fernando, Sanchitha N. ; Lin, Angel T. H. ; Singh, Pushpapraj ; Sharma, Jaibir ; Chua, Geng L. ; Bangtao Chen ; Gu, Alex Y. D. ; Singh, Navab ; Dim-Lee Kwong

Author_Institution

Inst. of Microelectron., Agency for Sci., Technol. & Res., Singapore, Singapore

fYear

2014

Abstract

A monolithic 9 degree of freedom capacitive inertial MEMS platform is presented in this paper. This platform for the first time integrates 3 axis gyroscopes, accelerometers, and Lorentz Force magnetometers together on the same chip without using any magnetic materials. This reduces the assembly cost, and fully eliminates the need of magnetic material processing and axis misalignment calibration. The fabricated sensors, vacuum packaged (vacuum ~100mTorr) at wafer level with epi-polysilicon through silicon interposer (TSI) wafer using eutectic bonding, performed within 10% of the simulation results.

Keywords

accelerometers; gyroscopes; inertial navigation; magnetic sensors; magnetometers; micromechanical devices; wafer level packaging; 3 axis gyroscopes; DOF capacitive inertial MEMS platform; Lorentz force magnetometers; TSI wafer; accelerometers; axis misalignment calibration; epipolysilicon through silicon interposer wafer; eutectic bonding; magnetic material processing; monolithic 9 degree of freedom; wafer level; Accelerometers; Cavity resonators; Gyroscopes; Magnetic sensors; Magnetometers; Micromechanical devices;

fLanguage

English

Publisher

ieee

Conference_Titel

Electron Devices Meeting (IEDM), 2014 IEEE International

Type

conf

DOI

10.1109/IEDM.2014.7047103

Filename

7047103