DocumentCode
3565188
Title
Thin-film heterojunction field-effect transistors for ultimate voltage scaling and low-temperature large-area fabrication of active-matrix backplanes
Author
Hekmatshoar, Bahman ; Afzali-Ardakani, Ali
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2014
Abstract
Thin-Film heterojunction field-effect transistor (HJFET) devices with crystalline Si (c-Si) channels and gate regions comprised of hydrogenated amorphous silicon (a-Si:H) or organic materials are demonstrated. The HJFET devices are processed at 200°C and room temperature, respectively; and exhibit operation voltages below 1V, subthreshold slopes in the range of 70-100mV/dec and off-currents as low as 25 fA/μm. The HJFET devices are proposed for use in active matrix backplanes comprised of low-temperature poly-Si (LTPS) as the c-Si substrate. Compared to conventional LTPS devices which require process temperatures up to 600°C and complex fabrication steps, the HJFET devices offer lower process temperature, simpler fabrication steps and lower operation voltages without compromising leakage or stability.
Keywords
elemental semiconductors; field effect transistors; silicon; thin film transistors; HJFET; LTPS; Si; a-Si:H; active matrix backplane; active-matrix backplane; c-Si channel; c-Si substrate; crystalline Si channel; hydrogenated amorphous silicon; low-temperature large-area fabrication; low-temperature poly-Si; organic material; temperature 200 degC; temperature 293 K to 298 K; thin-film heterojunction field-effect transistor; ultimate voltage scaling; Dielectrics; Gate leakage; Logic gates; Silicon; Substrates; Thin film transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Electron Devices Meeting (IEDM), 2014 IEEE International
Type
conf
DOI
10.1109/IEDM.2014.7047111
Filename
7047111
Link To Document