Title :
Wafer level system integration for SiP
Author :
Yu, Douglas C. H.
Author_Institution :
Taiwan Semicond. Manuf. Co. R&D, Hsinchu, Taiwan
Abstract :
A family of novel wafer-level-system-integration technologies (WLSI) was proposed. This paper reviews WLSI feasibility work first. Further results on the reliability, the compatibility of the integration with both more advanced node Logic and DRAM devices, and the higher-level system integration of the WLSI technologies are then presented. Foundry has established a comprehensive system integration technology portfolio in wafer form to fulfill the needs from mobile to cloud computing for the future growth of the Si-based nano-electronics industry.
Keywords :
DRAM chips; cloud computing; elemental semiconductors; mobile computing; nanoelectronics; silicon; system-in-package; wafer level packaging; DRAM devices; SiP; cloud computing; mobile computing; nanoelectronics industry; node logic; wafer level system integration; FinFETs; Integrated circuit reliability; Semiconductor device reliability; Three-dimensional displays; Through-silicon vias;
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
DOI :
10.1109/IEDM.2014.7047117
