DocumentCode :
3565280
Title :
New insights into the design for end-of-life variability of NBTI in scaled high-κ/metal-gate Technology for the nano-reliability era
Author :
Pengpeng Ren ; Runsheng Wang ; Zhigang Ji ; Peng Hao ; Xiaobo Jiang ; Shaofeng Guo ; Mulong Luo ; Meng Duan ; Zhang, Jian F. ; Jianping Wang ; Jinhua Liu ; Weihai Bu ; Jingang Wu ; Waisum Wong ; Yu Shaofeng ; Hanming Wu ; Shiuh-Wuu Lee ; Nuo Xu ; Ru Huang
Author_Institution :
Inst. of Microelectron., Peking Univ., Beijing, China
fYear :
2014
Abstract :
In this paper, a new methodology for the assessment of end-of-life variability of NBTI is proposed for the first time. By introducing the concept of characteristic failure probability, the uncertainty in the predicted 10-year VDD is addressed. Based on this, variability resulted from NBTI degradation at end of life under specific VDD is extensively studied with a novel characterization technique. With the further circuit level analysis based on this new methodology, the timing margin can be relaxed. The new methodology has also been extended to FinFET in this work. The wide applicability of this methodology is helpful to future reliability/variability-aware circuit design in nano-CMOS technology.
Keywords :
MOSFET; negative bias temperature instability; probability; semiconductor device reliability; FinFET; NBTI; VDD; circuit level analysis; end-of-life variability; failure probability characteristics; nanoCMOS technology; nanoreliability era; reliability-variability-aware circuit design; scaled high-κ-metal-gate technology; time 10 year; Degradation; Dispersion; FinFETs; Logic gates; Nanoscale devices; Probability; Stress;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electron Devices Meeting (IEDM), 2014 IEEE International
Type :
conf
DOI :
10.1109/IEDM.2014.7047165
Filename :
7047165
Link To Document :
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