مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

3565727

Title :

Organizers and sponsors

fYear :

2014

Firstpage :

498

Lastpage :

498

Abstract :

The conference organizers greatly appreciate the support of the various corporate sponsors listed.

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International

Type :

conf

DOI :

10.1109/IMPACT.2014.7048344

Filename :

7048344

Link To Document :