DocumentCode :
3565728
Title :
Direct metallization technology introduction
Author :
Beston Liu
fYear :
2014
Firstpage :
351
Lastpage :
354
Abstract :
This paper provides an overview of three kind of direct metallization processes, summarize the process principle and process flow of palladium activated direct metallization, conductive polymer direct metallization and carbon black activated direct metallization processes. The advantages and disadvantages of three kinds of processes were compared, and the investigation of selective organic conductive coating reliability.
Keywords :
activated carbon; conducting polymers; electroplating; metallisation; carbon black activated direct metallization processes; conductive polymer direct metallization; palladium activated direct metallization; process flow; process principle; selective organic conductive coating reliability; Carbon; Copper; Graphite; Metallization; Palladium; Polymers; Surface treatment; Black Hole; Conductive Polymer; Direct Metallization; palladium;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
Type :
conf
DOI :
10.1109/IMPACT.2014.7048345
Filename :
7048345
Link To Document :
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