Micro texture control for highly reliable copper fine bumps for 3D integration

Author

Gotoh, Masara ; Suzuki, Ken ; Miura, Hideo

Author_Institution

Dept. of Nanomech., Tohoku Univ., Sendai, Japan

fYear

2014

Firstpage

53

Lastpage

56

Abstract

The variation and fluctuation of mechanical properties of the electroplated copper fine bumps degrade the long-term reliability of the interconnections in 3D modules. The life of the fine bump joints under electro migration and stress-induced migration loads was investigated experimentally and it was confirmed that the micro texture of the fine bumps should be controlled appropriately in order to assure the long-term reliability. It was found that the formation of high quality columnar grains with (001) orientation can improve the reliability drastically.

Keywords

copper; electromigration; electroplating; integrated circuit interconnections; integrated circuit reliability; mechanical properties; three-dimensional integrated circuits; 3D integration; 3D module interconnections; Cu; electromigration; electroplated copper fine bumps; high quality columnar grains; long-term reliability; mechanical property; micro texture control; stress-induced migration loads; Annealing; Copper; Current density; Fluctuations; Mechanical factors; Three-dimensional displays;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International

Type

conf

DOI

10.1109/IMPACT.2014.7048346

Filename

7048346