Title :
Micro texture control for highly reliable copper fine bumps for 3D integration
Author :
Gotoh, Masara ; Suzuki, Ken ; Miura, Hideo
Author_Institution :
Dept. of Nanomech., Tohoku Univ., Sendai, Japan
Abstract :
The variation and fluctuation of mechanical properties of the electroplated copper fine bumps degrade the long-term reliability of the interconnections in 3D modules. The life of the fine bump joints under electro migration and stress-induced migration loads was investigated experimentally and it was confirmed that the micro texture of the fine bumps should be controlled appropriately in order to assure the long-term reliability. It was found that the formation of high quality columnar grains with (001) orientation can improve the reliability drastically.
Keywords :
copper; electromigration; electroplating; integrated circuit interconnections; integrated circuit reliability; mechanical properties; three-dimensional integrated circuits; 3D integration; 3D module interconnections; Cu; electromigration; electroplated copper fine bumps; high quality columnar grains; long-term reliability; mechanical property; micro texture control; stress-induced migration loads; Annealing; Copper; Current density; Fluctuations; Mechanical factors; Three-dimensional displays;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048346
