Title :
Quality control of grain boundaries in copper thin films used for 3D interconnections
Author :
Nakanishi, Takahiro ; Suzuki, Ken ; Miura, Hideo
Author_Institution :
Dept. of Nanomech., Tohoku Univ., Sendai, Japan
Abstract :
In this study, the quality of grain boundaries was evaluated by measuring their strength. In order to evaluate the strength of grain boundaries quantitatively, a micro-tensile test method that can measure the strength of a grain boundary has been developed. A focused ion beam was used for making a fine columnar sample which consisted of two grains in series. The sample was jointed to a small both ends fixed beam made of single-crystalline silicon. A tensile load was applied and the deformation of the sample and the beam was monitored by a scanning electron microscope to measure the load-displacement relationship of the sample. The relationship between the factors of controlling strength and the mechanical properties of the copper thin films was clarified quantitatively by using the micro-tensile test.
Keywords :
copper; focused ion beam technology; grain boundaries; mechanical properties; quality control; scanning electron microscopes; tensile strength; tensile testing; 3D interconnections; Cu; copper thin films; fine columnar sample; focused ion beam; grain boundaries; load-displacement relationship; mechanical properties; microtensile test method; quality control; scanning electron microscope; single-crystalline silicon; tensile load; Copper; Grain boundaries; Scanning electron microscopy; Silicon; Springs;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048348