• DocumentCode
    3565743
  • Title

    Quantitative evaluation of the quality of grains and grain boundaries in copper thin films used for 3D interconnections

  • Author

    Murakoshi, Takuya ; Suzuki, Ken ; Miura, Hideo

  • Author_Institution
    Dept. of Nanomech., Tohoku Univ., Sendai, Japan
  • fYear
    2014
  • Firstpage
    69
  • Lastpage
    72
  • Abstract
    The relationship of mechanical properties and micro texture of electroplated copper thin films used for 3D interconnections was investigated using a SEM, and an EBSD method. As a result, it was found that the mechanical properties changed due to the change of the average grain size and the crystallinity of grains and grain boundaries.
  • Keywords
    copper; electron backscattering; electron diffraction; electroplating; grain boundaries; grain size; interconnections; metallic thin films; scanning electron microscopy; 3D interconnections; Cu; EBSD method; SEM; average grain size; crystallinity; electroplated copper thin films; grain boundary quality; mechanical properties; microtexture; Annealing; Copper; Films; Grain boundaries; Residual stresses; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
  • Type

    conf

  • DOI
    10.1109/IMPACT.2014.7048349
  • Filename
    7048349
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3565743