Title :
LED flip chip packaging trends with tear down study
Author_Institution :
Grand Joint Technol. Ltd., Hong Kong, China
Abstract :
LED Solid state lighting is becoming increasingly important in the future & high performance is required more. Checking LED device actual inside, to confirm packaging structure and key LED packaging technology current status of Europe, US and Asian LED flip chip packaging. Also describe the current status of research and development situation on LED flip-chip and wafer-level LED packaging. This paper show LED flip chip packaging technology trends. - Study of LED high power flip chip type packaging technology with x-rays analysis - Key LED packaging technology trends.
Keywords :
flip-chip devices; light emitting diodes; research and development; wafer level packaging; LED flip chip packaging; LED solid state lighting; research and development; tear down study; wafer-level LED packaging; Aluminum oxide; Ceramics; Flip-chip devices; Light emitting diodes; Market research; Packaging; Substrates; LED flip chip device; LED lighting; X-rays analysis;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048358
