BMV filling in VCL for advanced IC substrates production

Manufacturing progress for all electronics production is determined by the driving forces for the industry which can be summarised as a demand for reduction in costs with improvement in performance - or just short: "faster, smaller and cheaper." For further development progress in circuit miniaturization coupled with the reduction of overall process costs and for meeting the demand for ever more filled BMV\´s on each plated layer, advances in via filling are required. The filling processes used for a stable production must provide void free, i. e. inclusion free filling and a minimum of surface plated copper simultaneously. This paper describes how to reliably fill BMV\´s with finest lines and spaces in pattern plate mode with vertical conveyorized lines. The findings are based on equipment using insoluble anodes together with a copper replenishment process. The result of our investigations is an electrolyte with improved BMV filling capability, better within-unit distribution and longer lifetime compared to existing via filling systems.