Fabrication of fine pitch copper patterns on flexible substrate

In order to fabricate flexible microelectronic devices, fabrication of metallization lines and metal electrodes on the flexible substrate is essential. For minimizing the size of device, the realization of metallization lines with the scale of a few micrometers on the flexible substrate is very important. In this study, pulse electroplating has been applied in order to metalize PI surfaces with Cu. The micro-scale fine patterns Cu metallization processes on PI substrate are described.