Title :
Direct liquid cooling For IGBT power module
Author :
Chun-Kai Liu ; Yu-Lin Chao ; Shu-Jung Yang ; Rong-Chang Fang ; Wei-Kuo Han ; Jack Tu ; Lin, Amy ; Yen, M.H. ; Liao, C.K.
Author_Institution :
Electron. & Optoelectron. Res. Labs., Ind. Technol. Res. Inst., Hsinchu, Taiwan
Abstract :
Power electronics systems trend to decrease size, increase switching frequency and voltage ratings. This has resulted in higher power dissipation dnesities of IGBT modules and higher junction temperature of IGBT devices. Thermal management becomes an important package design criteria. From the thermal resistance network of conventional indirect IGBT power module, the thermal interface material between IGBT power module and system cooler occupies a significant part. The present paper studies the thermal effects of IGBT power module with direct liquid cooling design. The microchannel cold plate is bonded with DBC substrate directly and elimitation thermal interface material. Thermal simulations of IGBT power with indirect liquid cooling and direct liquid cooling are complished and compared. The direct liquid cooling using microchannel cold plate can reduce thermal resistance and cooler size of IGBT power module effectively. Additionally, the microchannel cold plate can decrease the warpage and increase reliability of IGBT power module.
Keywords :
cooling; insulated gate bipolar transistors; microchannel plates; power semiconductor devices; thermal management (packaging); thermal resistance; IGBT power module; direct liquid cooling; junction temperature; microchannel cold plate; power dissipation; power electronics systems; thermal interface material; thermal management; thermal resistance; Insulated gate bipolar transistors; Liquid cooling; Microchannels; Multichip modules; Substrates; Thermal resistance;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2014 9th International
DOI :
10.1109/IMPACT.2014.7048421
